The vacuum chamber epoxy dispensing machine is a fully automatic industrial two-component AB glue mixing and potting equipment specially developed for high-end bubble-free resin encapsulation requirements. Different from ordinary desktop dispensers that work under atmospheric pressure, this machine completes glue degassing, static/dynamic mixing, and precise dispensing in a fully closed vacuum environment, effectively eliminating air bubbles, pinholes, and hollow defects that commonly occur during epoxy resin potting. As a core solution for high-precision electronics encapsulation, the equipment is widely recognized for its stable ratio control, zero-bubble potting effect, and fully automated production capacity. Designed for epoxy resin, PU resin, and silicone two-component adhesives, the automatic vacuum epoxy potting machine supports adjustable glue ratios from 1:1 to 10:1 and adapts to glue viscosities from low fluidity to high viscosity. Equipped with servo quantitative metering system and 3-axis programmable motion control, it delivers consistent dispensing volume, accurate positioning, and excellent batch repeatability. Whether for small-batch prototype production or large-scale mass manufacturing, the equipment maintains high yield and stable product quality.
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Item
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Technical Parameter
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Equipment Name
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Vacuum Chamber Epoxy Dispensing Machine
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Two-component epoxy resin, PU glue, silicone AB glue
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Glue Mixing Ratio
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1:1 ~ 10:1 (adjustable arbitrarily)
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Glue Viscosity Range
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50cps – 35000cps
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Dispensing Accuracy
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±2% (stable batch consistency)
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Vacuum Pump Power & Efficiency
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40L/s high-efficiency vacuum pump, rapid cavity evacuation
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Vacuum Degree
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-0.095MPa (adjustable)
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Working Stroke (X/Y/Z Axis)
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600*500*100mm (customizable)
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Transmission Mode
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Servo motor + precision screw rod
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Control System
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PLC intelligent control + touch screen operation
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Dispensing Speed
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0.1-100mm/s (adjustable)
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Tank Material
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Food-grade stainless steel (anti-corrosion, easy cleaning)
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Working Environment
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Temperature 5-80℃, humidity 20%-80% (no condensation)
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Customization Support
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Chamber size, stroke, glue output volume, assembly line integration
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