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Complete Silicone Potting Machine | Two Component Silicone Mix and Dispense System
Our two component silicone dispensing machine is a professional 2K meter-mix system for metering, mixing and dispensing AB silicone, including transparent optical silicone, thermally conductive silicone and filled silicone sealant. Designed to handle silicone’s high viscosity and filler sedimentation features, it delivers stable ratio control and precise dispensing for electronic potting, sealing and encapsulation. The complete set comprises A&B storage tanks, precision metering pumps, back-suction anti-drip dispensing valve, static/dynamic mixing assembly, PLC touch control system, pressure regulators and material level sensors. Optional modules include tank stirring, heating unit, vacuum chamber, 3-axis gantry robot and tunnel curing oven. It supports adjustable mixing ratios from 1:1 to 10:1 with ±2% metering accuracy. A and B silicone are stored separately and mixed only at the nozzle, preventing premature curing and reducing raw material waste. The optional tank stirring function effectively avoids filler settlement for filled thermal conductive silicone. The English HMI can save multiple product recipes for quick formula switching. The back-suction valve ensures clean cut-off without silicone stringing. The optional vacuum chamber removes trapped air to achieve bubble-free transparent silicone encapsulation. It is widely used for LED COB modules, automotive electronics, power inverters, PCB boards, sensors and electrical connectors. The silicone layer protects components against moisture, vibration and thermal cycling. We support customization of voltage, pump types and tank capacity. Suitable for lab trial runs and continuous mass production, this system provides reliable silicone dispensing solutions for electronic manufacturers.
Complete Silicone Potting Machine is a two component silicone mix and dispense system for AB silicone potting and sealing. It supports transparent, thermally conductive and filled silicone with ±2% metering accuracy. Equipped with PLC touch control, anti-drip valve and optional stirring and vacuum modules. Ideal for LED modules, automotive electronics, power inverters and PCB encapsulation. Flexible ratio adjustment and recipe storage support small batch and mass silicone potting production.
Key Features
✅ Precision Meter & Mix System High precision pump system for two-component glue, stable ratio control 1:1~10:1, consistent dispensing volume, avoid over-dispensing or shortage.
✅ Real-time Online Mixing AB glue mixes at static/dynamic mixer tip. No glue solidification inside tank or pipeline, reduce material waste.
✅ PLC + Touch Screen Intelligent Control Save multiple dispensing programs, easy parameter setting, USB program import, password protection.
✅ Optional Vacuum Potting Function Vacuum chamber degassing to eliminate air bubbles for compact, smooth potting layer, critical for high voltage electronics.
✅ Wide Material Compatibility Work with epoxy resin, PU polyurethane resin, 2K silicone, thermal conductive AB compound, doming resin.
✅ Anti-dripping & Anti-drawing Design Glue suck-back function, clean glue cut, no dripping at nozzle.
✅ Customizable Automation 3/4 axis motion platform, rotary table, conveyor inline integration, heating & stirring tank, automatic flushing.
✅ Low Material Level Alarm Alert when A/B glue runs low, prevent machine idle running and damage.
Advantages
- Reduce manual potting cost, greatly improve production throughput and product consistency.
- Minimize bubble defect rate for electronic encapsulation, enhance insulation & waterproof performance.
- Stable ratio control to avoid bad batch caused by manual mixing.
- Modular structure, easy maintenance and spare parts replacement.
- OEM & ODM available, tailor-made for different product sizes and glue formulas.
- 12-month warranty, overseas technical support and remote debugging.
Working Principle
Step 1: Material Preparation & Tank Conditioning
✅Heating: Electric heating bands reduce viscosity to ensure smooth flow.
✅Agitation: Continuous stirring prevents filler sedimentation (e.g., thermal conductive powders).
✅Vacuum Degassing: Removes micro-bubbles under negative vacuum pressure < -0.095 MPa prior to feeding into pumps.
Step 2: High-Precision Metering & Proportioning
✅Dual servo motors drive precision gear or piston pumps to draw Resin (A) and Hardener (B) from separate stainless steel pressure vessels.
✅System monitors volumetric flow rate continuously to enforce precise stoichiometric mixing ratios (1:1 up to 10:1).
Step 3: Mixing Mechanism
✅Dynamic Mixing: A high-speed rotating motor mixes viscous or high-ratio liquids inside an easy-clean dynamic chamber.
✅Static Mixing: Helical mixer nozzles force material layers to cross-divide repeatedly for low-viscosity or quick-curing formulas.
Step 4: Dispensing & Potting
✅Servo-driven XYZ robotic gantry or multi-axis CNC system executes preset potting trajectories (dots, lines, arcs, continuous potting) over the workpiece.
✅Automatic purge cycles flush the mixing valve with solvent or Component A to prevent internal curing during downtime
Specification
|
ITEM |
Parameter |
| Mixing ratio | 1:1–10:1 adjustable |
| Working range | 600*600*100mm |
| Displacement speed | 200mm/s（speed） |
| Out-glue speed | 5-20g/s |
| Accuracy | ±2%（output volume）±2%（mixing） |
| tolerance | ≤0.2mm |
| Flow control | Digital input |
| Program memory | 99pcs |
| Motion trail | Dot , line ,curve ,circle |
| Automatic controlling system | Touch screen (to achieve program programming, modification, storage and so on |
| Out-glue control system | AB glue back suction valve, achieve AB glue independent operation |
| Programmatically | Tech programming With computer systems (Micro software Windows 7,Windows10 optional) |
| Mixing method | dynamic mixing/Static Mixing |
| Power supply | 220V/50Hz/1500W |
| Air source | 0.5-0.8Mpa( suggest 0.7Mpa) |
| Viscosity range | 50-30000cps |
| Outer dimension | CUSTOMIZED |
| A tank | 25L stainless tank（optional） |
| B tank | 10L stainless tank（optional） |
| Others | AB tank 、A pump、AB pipeline heating function |
Applications
Power electronics: current transformer, transformer, LED driver, solid relay, power supply module
New energy: solar junction box, energy storage module, battery pack encapsulation
Automotive electronics: automotive radar sensor, pressure/temperature sensor, ECU potting
Electronic components: PCB, buzzer, capacitor, controller module
Decoration & label: epoxy doming, badge sticker, crystal resin filling
Frequently Asked Questions
Q1: What materials can this epoxy mixing and dispensing machine process?
A: It works for two-component materials including epoxy resin, PU polyurethane and silicone. It supports low viscosity resin, high viscosity filled epoxy with mineral powder, as well as abrasive filler materials for electronic potting and encapsulation.
Q2: What mixing ratios are supported?
A: Standard adjustable ratio ranges from 1:1 to 10:1. Custom ratio can be made according to your glue datasheet. The metering accuracy is within ±2%.
Q3: What is the difference between static mixer and dynamic mixer?
A: Static mixing tube suits low/medium viscosity, unfilled epoxy. Dynamic mixer is for high-viscosity, filled resin with powder, offering more uniform mixing. We can configure the mixing type based on your glue formula.
Q4: Can the machine work for vacuum potting?
A: Yes. The vacuum chamber is an optional accessory. Vacuum potting removes air bubbles inside resin, achieving bubble-free encapsulation for high-end products like current transformers and automotive sensors.
Q5: Is 3-axis robot included in the complete set?
A: No. The standard complete set contains tanks, metering pumps, dispensing valve, mixing assembly and PLC control system. 3-axis gantry robot, vacuum chamber and tunnel curing oven are optional add-ons.
Q6: Does the machine support multiple product recipes?
A: Yes. The PLC touchscreen can save dozens of recipes. You can call preset parameters with one click when switching different products, reducing changeover time.
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