Two Component Epoxy Dosing Machine| 2K Resin Metering Dispenser

In high-reliability manufacturing across electronics, automotive, and renewable energy sectors, consistent fluid dosing and dispensing are vital for quality control. The KPD Automatic Two-Component Epoxy Resin Dosing & Dispensing Machine combines advanced volumetric dosing pumps with dynamic mixing technology to automate your 2K resin application seamlessly.

Key Features

✅Auto feeding : take use of vacuum pressure to feed materials into A&B tank separately.

✅Tank Stirring : A and B tank configure with stirring motors and blades to prevent material sediment in the tank bottom .

✅Heating : Tank , pipe , pumps are optional with heaters to assure the whole system can be heating from room temperature to 90°C adjustable.

✅Vacuum : A &B tank vacuum for degas the bubble inside material .

✅Dynamic mixing : Configuring dynamic motor and mixer to mix A and B fluids evenl

Advantages

1. Reduce manual potting cost, greatly improve production throughput and product consistency.
2. Minimize bubble defect rate for electronic encapsulation, enhance insulation and waterproof performance.
3. Stable ratio control to avoid bad batch caused by manual mixing.
4. Modular structure, easy maintenance and spare parts replacement.
5. OEM and ODM available, tailor-made for different product sizes and glue formulas.
6. 12-month warranty, overseas technical support and remote debugging.

Working Principle

The semi-automatic potting machine is designed for two-component adhesive (A & B glue) dispensing and potting.
Raw material Part A and Part B are separately stored in sealed pressure tanks. Under stable pneumatic pressure, the two glues are delivered to a metering system. Precision metering pumps control the flow rate and mixing ratio accurately according to the preset formula.
A & B materials converge and get fully mixed inside the static mixing tube, then the mixed adhesive flows to the dispensing valve. Operators manually position the workpiece or control the movement of the dispensing head. When the valve opens, uniform mixed glue is dispensed onto the workpiece for potting, sealing and encapsulation.
After dispensing, the mixing nozzle can be cleaned automatically or manually to avoid residual glue curing and blockage.

Specification

Applications

✅ Electronic components and PCB potting

✅ Transformer and inductor encapsulation

✅ LED driver and power supply potting

✅ Sensor and automotive electronic encapsulation

✅ Motor coils, capacitors, and electrical components

✅ Industrial sealing, bonding, and resin casting

FAQ

Q1: What is the difference between a semi-automatic and a fully automatic potting machine?

A: A semi-automatic dispensing machine handles precise A:B volumetric proportioning, online mixing, and quantitative delivery automatically, but requires manual placement/removal of the workpiece or manual triggering (e.g., via a foot pedal or handheld gun). It is ideal for batch production, variable workpieces, and businesses looking for a cost-effective automation upgrade.

Q2: Which types of resins can this semi-automatic machine process?

A: It is fully compatible with most two-part (2K) polymer systems, including epoxy resins, polyurethanes (PU), and silicones. It can handle low-viscosity liquids as well as medium-to-high viscosity resins containing abrasive or thermal fillers (such as silica or aluminum oxide powders).

Q3: How does the machine control the mixing ratio and prevent ratio errors?

A: The system utilizes high-precision gear pumps or piston pumps driven by independent motors. It continuously delivers components A and B according to a preset ratio (ranging from 1:1 up to 10:1) with a volumetric metering accuracy within ±1.0%, completely eliminating manual proportioning mistakes.