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Automatic Meter Mix Dispense Equipment for Polyurethane and Epoxy Potting
The Automatic Meter Mix Dispensing Equipment is designed for precise metering, mixing and dispensing of two-component materials such as polyurethane (PU) and epoxy resin. The system independently supplies Components A and B, accurately controls the required mixing ratio, and delivers the mixed material to the workpiece for consistent potting, encapsulation, sealing and bonding. With programmable dispensing parameters and automatic operation, the system helps improve dispensing consistency, production efficiency and process repeatability. It can be configured with precision metering pumps, static or dynamic mixing systems, heating, vacuum degassing and multi-axis positioning according to different material and production requirements. The equipment is widely used for electronic components, PCBs, sensors, transformers, automotive electronics, LED products, energy storage components and other industrial applications requiring reliable two-component material dispensing.
Automatic Meter Mix Dispensing Equipment for Polyurethane and Epoxy Potting is designed for accurate metering, mixing and automatic dispensing of two-component materials such as polyurethane (PU) and epoxy resin.
The system precisely meters Components A and B according to the required mixing ratio, mixes them through a static or dynamic mixing system, and dispenses the material onto the workpiece with consistent volume and repeatability.
It is suitable for electronic components, automotive parts, sensors, transformers, coils, energy storage components, LED products and other industrial potting applications.
Key Features
- 1. Accurate 2K Metering – Precise control of A/B material ratio and dispensing volume.
- 2. Automatic Mixing – Efficient mixing of polyurethane and epoxy materials before application.
- 3. Stable Dispensing – Consistent output for repeatable potting and encapsulation.
- 4. Adjustable Mixing Ratio – Configurable according to different two-component material requirements.
- 5. Programmable Operation – Supports automatic dispensing paths, volume and process parameters.
- 6. Wide Material Compatibility – Suitable for epoxy, polyurethane and other two-component compounds.
- Industrial Automation – Can be integrated with conveyors, positioning systems and production lines.
Working Principle
Component A + Component B → Precision Metering → Ratio Control → Mixing → Dispensing → Potting / Encapsulation
The two components are supplied from separate material tanks and delivered through independent metering pumps. The system controls the required A:B ratio before the materials enter the mixing system. After thorough mixing, the material is dispensed onto the target workpiece according to the programmed dispensing path and volume.
Applications
| Application | Typical Use |
|---|---|
| Electronics | PCB and electronic component protection |
| Automotive | Sensors, control modules and automotive components |
| Transformers | Coil and transformer encapsulation |
| Energy Storage | Battery and energy storage component potting |
| Sensors | Sensor sealing and environmental protection |
| LED | LED components and electronic encapsulation |
| Coils | Coil insulation and protection |
| Industrial Components | Waterproofing, insulation and mechanical protection |
Materials
Compatible two-component materials may include:
- Epoxy Resin
- Polyurethane (PU)
- Silicone
- AB Adhesive
- Potting Compound
- Two-Component Sealants
Actual compatibility depends on material viscosity, mixing ratio, curing characteristics and application requirements.
Specification Table
| Specification | Description |
|---|---|
| Equipment Type | Automatic 2K Meter Mix Dispensing System |
| Material | Epoxy / Polyurethane / Silicone / AB Adhesive |
| Components | A + B |
| Mixing Ratio | Customizable according to material |
| Metering Method | Precision Pump Metering |
| Dispensing Mode | Automatic Programmable Dispensing |
| Mixing System | Static or Dynamic Mixing |
| Control System | PLC / Touchscreen |
| Dispensing Path | Point / Line / Curve / Area |
| Application | Potting, Encapsulation, Sealing, Bonding |
| Automation | Semi-Automatic / Fully Automatic |
| Customization | Available |
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