AB part epoxy resin potting machine

The Epoxy Resin Potting Machine integrates material storage, metering, mixing and dispensing into one automated system. Components A and B are stored separately to prevent premature curing. The metering system delivers each component according to the programmed mixing ratio. After metering, the two materials are mixed through a static or dynamic mixing system and then dispensed onto the workpiece. For applications where air bubbles can affect encapsulation quality, vacuum degassing can be incorporated into the material preparation process. Heating and stirring functions can also be configured according to the epoxy resin characteristics. The dispensing process can be programmed for dots, lines, areas, circles, arcs and irregular paths, making the equipment suitable for different product geometries and production requirements.

Our Epoxy Resin Potting Machine is an automated encapsulation system specially designed for two-part epoxy resin and hardener. It accurately meters, dynamically mixes and dispenses epoxy compounds with ±2% volumetric accuracy, supporting adjustable mixing ratios from 1:1 up to 10:1. Pair it with our vacuum potting chamber to eliminate trapped air bubbles and achieve void-free epoxy encapsulation. This machine is widely used for potting current transformers, LED drivers, power modules and PCB assemblies. It replaces manual epoxy mixing, cuts adhesive waste and stabilizes finished product quality. We also supply our two component glue metering machine for standalone AB resin mixing tasks. Contact KPD Automation for custom configuration and free epoxy glue testing.

Key Features

Closed-Loop Volumetric Metering: Servo-driven high-precision metering pumps continuously monitor and auto-correct dispense speed and shot volume, ensuring steady flow even during viscosity shifts.

  • Active Vacuum Degassing: Stainless steel pressure vessels draw down to -0.098 MPa to remove micro-bubbles from both resin (Part A) and hardener (Part B) before they reach the mixing chamber.

  • Auto-Purge Anti-Clogging Guard: Programmable software automatically performs timed purge cycles during production line pauses, preventing resin from curing inside the mixing head.

  • Smart Material Conditioning: Equipped with low-level float sensors, automatic vacuum refilling, motorized agitators to prevent filler settling, and temperature-controlled tank jackets.

  • Programmable Motion Trajectories: HMI touchscreen allows operators to program dot, line, arc, circular, and multi-point continuous potting routines.

Applications

  • Electronics & Printed Circuit Boards (PCBs): Conformal potting and encapsulation for power supplies, relays, igniters, and control modules.

  • Automotive & EV Industry: Thermal conductive potting for Electric Vehicle Battery Management Systems (BMS), sensors, onboard chargers, and motors.

  • Electrical Components: Structural casting for high-voltage transformers, inductors, solenoids, and capacitors.

  • LED Lighting & Solar Enclosures: Waterproof and weatherproof sealing for outdoor LED drivers, junction boxes, and solar panel modules.

Key Advantages

  • Zero Micro-Bubbles: Active degassing and air-free inline mixing eliminate voids, ensuring high dielectric breakdown resistance and maximum structural strength.

  • Drastic Cost Reduction: Eliminates manual weighing errors and pot-life expiration scrap, reducing raw resin waste by up to 30%

  • Consistent Quality Control: Automated ratio lock prevents uncured “soft spots” or brittle resin caused by incorrect manual mixing.

  • High Production Yield: Multi-nozzle options and continuous bead dispensing drastically decrease cycle time compared to manual pouring.

Working Principle

The two part potting compound filling machine separately pumps A component and B component potting compound from material tanks. The servo metering system controls the volume of A and B glue according to preset ratio. Two materials flow into mixing unit for fully mixing, then the mixed two part potting compound is dispensed and filled into workpieces. If equipped with vacuum system, the whole potting process runs under vacuum environment to prevent bubble generation.

 Specication

Item Parameter
Product Name Two part adhesive dispenser (2 Component AB Glue Potting Machine)
Glue Type Epoxy resin, Polyurethane (PU), Silicone two-part potting compound
A:B Mixing Ratio 1:1 ~ 10:1 (Adjustable via touch screen, customized ratio available)
Metering System Servo motor driven piston metering / Gear pump metering (optional)
Filling Range 1g ~ 5000g (Customizable)
Filling Accuracy ±2% (stable raw material viscosity)
Mixing Method Static mixer / Dynamic mixing (optional)
Material Tank A tank & B tank, 20L / 50L / 100L optionalTank with heating & stirring function (optional for high viscosity glue)
Vacuum System (Optional) Material tank vacuum degassing + workpiece vacuum potting chamberVacuum degree: ≤ -0.095MPa
Control System PLC + Color Touch Screen
Operation Mode Automatic / Manual mode switchable
Filling Speed Adjustable according to workpiece and glue viscosity
Power Supply AC 220V / 380V, 50/60Hz
Working Air Pressure 0.4 ~ 0.7 MPa
Machine Frame Carbon steel with paint / Stainless steel optional
Protection Overload protection, glue shortage alarm, leakage alarm
Application Transformer, LED driver, sensor, PCB, power module, capacitor encapsulation
Optional Accessories Vacuum chamber, heating tank, automatic workpiece fixture, conveyor line, cleaning station

Leave a Message

Leave us a message with any questions, we will reply as soon as possible.

KPD Automation Equipment Co.ltd
Chat on WhatsApp