Our complete set epoxy resin mixing and dispensing machine is a professional 2K meter-mix potting system engineered for two-component AB epoxy, polyurethane and silicone encapsulation in electronic manufacturing. Built for precision, stability and continuous mass production, this integrated equipment covers material storage, automatic metering, proportional mixing and accurate dispensing, serving as a one-stop solution for electronic component potting and protection. The whole unit consists of A & B material tanks, precision metering pumps, 2K dispensing valve, static/dynamic mixing assembly, PLC touchscreen control cabinet, material pipelines, pressure regulating modules, level sensors, emergency stop and safety alarm system. Customers may optionally add vacuum chamber, 3-axis gantry robot, heating & stirring mechanism and tunnel curing oven to form a fully automatic potting production line. The system supports adjustable mixing ratios ranging from 1:1 up to 10:1, with metering accuracy controlled within ±1%. It can handle materials of low to high viscosity, including filled epoxy resin with mineral fillers that tend to precipitate. A/B materials are stored separately and only mixed inside the mixing tube during dispensing, effectively preventing premature curing and reducing raw material waste. Operated via an English touch-screen interface, the machine allows operators to store multiple product formulas. Users can quickly recall preset recipes to switch between different products, greatly shortening product changeover time. The anti-drip dispensing valve achieves clean cut-off without stringing, ensuring neat potting surfaces. For high-end applications, the optional vacuum defoaming function removes air bubbles inside resin, delivering void-free encapsulation results. Built-in stirring in the tanks prevents filler sedimentation and guarantees consistent material properties throughout long production runs. Simple pump disassembly design makes daily cleaning and maintenance convenient, lowering downtime and operational costs. Widely applied in current transformers, LED drivers, solar junction boxes, automotive radar sensors, solid relays and PCB modules, this equipment seals electronics against moisture, dust, vibration and thermal stress. It meets strict insulation and reliability requirements for automotive, new energy and power electronics industries. Customization options include power voltage, pump type, tank capacity and automation grade to fit different workshop layouts and production volumes. Whether for small batch trial potting or continuous large-scale manufacturing, our complete epoxy mixing and dispensing system provides stable, repeatable potting quality and helps manufacturers improve productivity while cutting labor and material cost.
KPD 3 axis two component glue dispensing machine is an automatic XYZ robotic dispensing system for 2-part (AB) adhesives. It integrates automatic metering, static/dynamic mixing and precision dispensing in one desktop gantry robot.
This 3-axis AB glue dispenser accurately mixes epoxy, polyurethane, silicone two-component glue at adjustable ratios and performs programmable point, line, arc, circle and 3D trajectory dispensing for electronic potting, encapsulation and sealing.
✅ Precision Meter & Mix System High precision pump system for two-component glue, stable ratio control 1:1~10:1, consistent dispensing volume, avoid over-dispensing or shortage.
✅ Real-time Online Mixing AB glue mixes at static/dynamic mixer tip. No glue solidification inside tank or pipeline, reduce material waste.
✅ PLC + Touch Screen Intelligent Control Save multiple dispensing programs, easy parameter setting, USB program import, password protection.
✅ Optional Vacuum Potting Function Vacuum chamber degassing to eliminate air bubbles for compact, smooth potting layer, critical for high voltage electronics.
✅ Wide Material Compatibility Work with epoxy resin, PU polyurethane resin, 2K silicone, thermal conductive AB compound, doming resin.
✅ Anti-dripping & Anti-drawing Design Glue suck-back function, clean glue cut, no dripping at nozzle.
✅ Customizable Automation 3/4 axis motion platform, rotary table, conveyor inline integration, heating & stirring tank, automatic flushing.
✅ Low Material Level Alarm Alert when A/B glue runs low, prevent machine idle running and damage.

✅Heating: Electric heating bands reduce viscosity to ensure smooth flow.
✅Agitation: Continuous stirring prevents filler sedimentation (e.g., thermal conductive powders).
✅Vacuum Degassing: Removes micro-bubbles under negative vacuum pressure ($< -0.095text{ MPa}$) prior to feeding into pumps.
✅Dual servo motors drive precision gear or piston pumps to draw Resin (A) and Hardener (B) from separate stainless steel pressure vessels.
✅System monitors volumetric flow rate continuously to enforce precise stoichiometric mixing ratios ($1:1$ up to $10:1$).
✅Dynamic Mixing: A high-speed rotating motor mixes viscous or high-ratio liquids inside an easy-clean dynamic chamber.
✅Static Mixing: Helical mixer nozzles force material layers to cross-divide repeatedly for low-viscosity or quick-curing formulas.
✅Servo-driven XYZ robotic gantry or multi-axis CNC system executes preset potting trajectories (dots, lines, arcs, continuous potting) over the workpiece.
✅Automatic purge cycles flush the mixing valve with solvent or Component A to prevent internal curing during downtime

|
ITEM |
Parameter |
| Mixing ratio | 1:1–10:1 adjustable |
| Working range | 500*500*100mm |
| Displacement speed | 200mm/s(speed) |
| Out-glue speed | 5-20g/s |
| Accuracy | ±2%(output volume)±2%(mixing) |
| tolerance | ≤0.2mm |
| Flow control | Digital input |
| Program memory | 99pcs |
| Motion trail | Dot , line ,curve ,circle |
| Automatic controlling system | Touch screen (to achieve program programming, modification, storage and so on |
| Out-glue control system | AB glue back suction valve, achieve AB glue independent operation |
| Programmatically | Tech programming With computer systems (Micro software Windows 7,Windows10 optional) |
| Mixing method | dynamic mixing |
| Power supply | 220V/50Hz/1500W |
| Air source | 0.5-0.8Mpa |
| Viscosity range | 50-20000cps |
| Outer dimension | CUSTOMIZED |
| A tank | 25L stainless tank(optional) |
| B tank | 10L stainless tank(optional) |
| Others | AB tank 、A pump、AB pipeline heating function |
Power electronics: current transformer, transformer, LED driver, solid relay, power supply module
New energy: solar junction box, energy storage module, battery pack encapsulation
Automotive electronics: automotive radar sensor, pressure/temperature sensor, ECU potting
Electronic components: PCB, buzzer, capacitor, controller module
Decoration & label: epoxy doming, badge sticker, crystal resin filling

A: It works for two-component materials including epoxy resin, PU polyurethane and silicone. It supports low viscosity resin, high viscosity filled epoxy with mineral powder, as well as abrasive filler materials for electronic potting and encapsulation.
A: Standard adjustable ratio ranges from 1:1 to 10:1. Custom ratio can be made according to your glue datasheet. The metering accuracy is within ±1%.
A: Static mixing tube suits low/medium viscosity, unfilled epoxy. Dynamic mixer is for high-viscosity, filled resin with powder, offering more uniform mixing. We can configure the mixing type based on your glue formula.
A: Yes. The vacuum chamber is an optional accessory. Vacuum potting removes air bubbles inside resin, achieving bubble-free encapsulation for high-end products like current transformers and automotive sensors.
A: No. The standard complete set contains tanks, metering pumps, dispensing valve, mixing assembly and PLC control system. 3-axis gantry robot, vacuum chamber and tunnel curing oven are optional add-ons.
A: Yes. The PLC touchscreen can save dozens of recipes. You can call preset parameters with one click when switching different products, reducing changeover time.
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