Epoxy Potting Machine | 2K Epoxy Resin Dispensing & Potting

Epoxy Potting Machine is an automatic 2-component dispensing system designed for precise metering, mixing and potting of epoxy resin. It supports programmable dispensing paths and is suitable for electronic components, PCBs, transformers, sensors, power modules and other industrial applications.

Key Features

• 2K Epoxy Metering & Mixing
• High-Precision Ratio Control
• Automatic Vacuum Degassing
• A/B Material Tanks with Stirring
• Dynamic or Static Mixing
• Programmable XYZ Dispensing
• Precise Glue Flow Control
• Automatic Cleaning System
• PLC + Touchscreen Control
• Low-Bubble Epoxy Potting

Depending on the epoxy material, systems can use gear pumps, screw pumps or piston pumps, while vacuum degassing and dynamic mixing are commonly used for demanding two-component applications.

Working Principle

A Material + B Material → Metering → Ratio Control → Mixing → Degassing → Dispensing → Epoxy Potting → Curing

The A and B epoxy components are stored separately to prevent premature curing. The metering system accurately controls the required ratio, after which the materials are mixed through a static or dynamic mixing valve and dispensed into the target component. Vacuum degassing can be added to reduce trapped air and bubbles.

epoxy potting machine

Applications

potting and encapsulation machine

Advantages

Consistent Mixing Ratio
Accurate A/B metering helps maintain stable epoxy performance.

Reduced Material Waste
Automatic dispensing controls the required glue volume and dispensing path.

Bubble Reduction
Vacuum degassing helps reduce air bubbles during epoxy potting.

Automation & Repeatability
Programmable XYZ motion allows repeatable point, line, surface and contour dispensing.

Flexible Production
The system can be configured for different epoxy viscosities, mixing ratios, dispensing volumes and production requirements.

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