KPD’s 3-axis automatic two-component dispensing and potting machine is designed for precise metering, mixing and dispensing of epoxy, silicone and PU adhesives. Featuring programmable XYZ motion control and a customizable A/B mixing ratio, it is ideal for electronic potting, component encapsulation, sealing and industrial bonding applications. Customized solutions are available to meet different production requirements.
KPD’s 3-axis automatic two-component dispensing and potting machine is designed for precision adhesive metering, mixing and dispensing in industrial manufacturing. It combines an automated XYZ motion system with a two-component metering and mixing unit to deliver consistent dispensing paths and controlled material delivery.
The system is suitable for two-component epoxy resin, polyurethane (PU) and silicone applications, including electronic encapsulation, component potting, sealing and adhesive bonding. The dispensing path, mixing ratio, working area and dispensing program can be configured according to the workpiece geometry, adhesive properties and production requirements.
With programmable motion control and an optional vacuum potting system, the machine helps manufacturers improve process consistency, reduce manual dispensing work and achieve repeatable production results.
✅ Precision Meter & Mix System High precision pump system for two-component glue, stable ratio control 1:1~10:1, consistent dispensing volume, avoid over-dispensing or shortage.
✅ Real-time Online Mixing AB glue mixes at static/dynamic mixer tip. No glue solidification inside tank or pipeline, reduce material waste.
✅ PLC + Touch Screen Intelligent Control Save multiple dispensing programs, easy parameter setting, USB program import, password protection.
✅ Optional Vacuum Potting Function Vacuum chamber degassing to eliminate air bubbles for compact, smooth potting layer, critical for high voltage electronics.
✅ Wide Material Compatibility Work with epoxy resin, PU polyurethane resin, 2K silicone, thermal conductive AB compound, doming resin.
✅ Anti-dripping & Anti-drawing Design Glue suck-back function, clean glue cut, no dripping at nozzle.
✅ Customizable Automation 3/4 axis motion platform, rotary table, conveyor inline integration, heating & stirring tank, automatic flushing.
✅ Low Material Level Alarm Alert when A/B glue runs low, prevent machine idle running and damage.

✅Heating: Electric heating bands reduce viscosity to ensure smooth flow.
✅Agitation: Continuous stirring prevents filler sedimentation (e.g., thermal conductive powders).
✅Vacuum Degassing: Removes micro-bubbles under negative vacuum pressure ($< -0.095text{ MPa}$) prior to feeding into pumps.
✅Dual servo motors drive precision gear or piston pumps to draw Resin (A) and Hardener (B) from separate stainless steel pressure vessels.
✅System monitors volumetric flow rate continuously to enforce precise stoichiometric mixing ratios ($1:1$ up to $10:1$).
✅Dynamic Mixing: A high-speed rotating motor mixes viscous or high-ratio liquids inside an easy-clean dynamic chamber.
✅Static Mixing: Helical mixer nozzles force material layers to cross-divide repeatedly for low-viscosity or quick-curing formulas.
✅Servo-driven XYZ robotic gantry or multi-axis CNC system executes preset potting trajectories (dots, lines, arcs, continuous potting) over the workpiece.
✅Automatic purge cycles flush the mixing valve with solvent or Component A to prevent internal curing during downtime

|
ITEM |
Parameter |
| Mixing ratio | 1:1–10:1 adjustable |
| Working range | 500*400*100mm |
| Displacement speed | 200mm/s(speed) |
| Out-glue speed | 5-20g/s |
| Accuracy | ±2%(output volume)±2%(mixing) |
| tolerance | ≤0.2mm |
| Flow control | Digital input |
| Program memory | 99pcs |
| Motion trail | Dot , line ,curve ,circle |
| Automatic controlling system | Touch screen (to achieve program programming, modification, storage and so on |
| Out-glue control system | AB glue back suction valve, achieve AB glue independent operation |
| Programmatically | Tech programming With computer systems (Micro software Windows 7,Windows10 optional) |
| Mixing method | dynamic mixing |
| Power supply | 220V/50Hz/1500W |
| Air source | 0.5-0.8Mpa |
| Viscosity range | 50-20000cps |
| Outer dimension | CUSTOMIZED |
| A tank | 25L stainless tank(optional) |
| B tank | 10L stainless tank(optional) |
| Others | AB tank 、A pump、AB pipeline heating function |
Power electronics: current transformer, transformer, LED driver, solid relay, power supply module
New energy: solar junction box, energy storage module, battery pack encapsulation
Automotive electronics: automotive radar sensor, pressure/temperature sensor, ECU potting
Electronic components: PCB, buzzer, capacitor, controller module
Decoration & label: epoxy doming, badge sticker, crystal resin filling

Q1: What materials can this two component dispenser machine handle?
A: Epoxy resin, PU resin, two-component silicone, thermal conductive AB glue, doming resin and other 2K liquid materials.
Q2: What mixing ratios are supported on this AB glue mixer dispensing machine?
A: Adjustable ratio from 1:1 to 10:1, custom ratio available upon request.
Q3: Is vacuum potting optional?
A: Yes, vacuum chamber module is optional for bubble-free potting for high requirement electronics.
Q4: Can we customize the machine size and dispensing travel?
A: Yes, we support OEM & ODM, customize working area, pump type, automatic conveyor integration.
Q5: What is the warranty of this PU resin dispenser potting machine?
A: 12 months warranty, lifetime technical consultation and spare parts supply.
Q6: Can the machine work with production line?
A: Yes, it can connect with conveyor, rotary table to realize inline automatic potting.
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