Two Component Glue Dispensing Machine for Epoxy, PU & Silicone

The Two Component Glue Dispensing Machine is an automatic 2K metering, mixing and dispensing system designed for precise processing of two-component adhesives such as epoxy, polyurethane (PU), silicone and structural adhesives. The machine independently stores and meters Component A and Component B according to the required mixing ratio, then mixes and dispenses the material accurately onto the workpiece. With precision metering pumps, dynamic or static mixing, programmable dispensing control and optional heating, stirring, vacuuming and pressure control, the system provides stable and repeatable adhesive processing. The CNC / XYZ motion platform enables accurate dispensing along different paths and work areas, making the machine suitable for potting, encapsulation, bonding, sealing and filling applications. The 2K glue dispensing machine can be configured with different pump systems, material tank capacities, mixing units and dispensing valves according to material viscosity, mixing ratio and production requirements. It is widely used for electronic components, PCB assemblies, transformers, sensors, automotive electronics, EV components, LED products, power supplies and industrial assemblies. By replacing manual mixing and dispensing with an automated process, the system helps improve dispensing consistency, reduce material waste, minimize operator dependency and support efficient production.

The Two Component Glue Dispensing Machine is an automatic 2K metering, mixing and dispensing system designed for processing two-component adhesives, including epoxy resin, polyurethane, silicone and other reactive materials.

The machine independently stores Component A and Component B, accurately meters each material according to the required mixing ratio, and mixes the two components before dispensing them onto or into the target workpiece.

With programmable dispensing parameters, precision metering pumps, dynamic or static mixing technology and CNC motion control, the system can be used for potting, encapsulation, sealing, bonding and filling applications in electronics, automotive, electrical, power and industrial manufacturing.

Key Features

Compact Design – Space-saving structure for efficient production.

  • Precision Metering – Accurate A/B material metering and ratio control.
  • Dynamic Mixing – Thorough and consistent mixing of 2K materials.
  • Automatic Dispensing – Programmable and repeatable dispensing process.
  • Vacuum Degassing – Helps reduce air bubbles in suitable materials.
  • Tank Stirring – Keeps materials evenly mixed and stable.
  • Material Heating – Helps control material temperature and viscosity.
  • Automatic Cleaning – Simplifies cleaning and reduces material residue.
  • PLC + HMI Control – Easy operation and real-time process monitoring.
  • Flexible Configuration – Suitable for epoxy, PU, silicone and 2K adhesives.
  • XYZ Precision Motion – Accurate dispensing paths for complex workpieces.
  • Production Line Integration – Can be integrated with conveyors and automated systems.

Applications

  • Electronics & Printed Circuit Boards (PCBs): Conformal potting and encapsulation for power supplies, relays, igniters, and control modules.

  • Automotive & EV Industry: Thermal conductive potting for Electric Vehicle Battery Management Systems (BMS), sensors, onboard chargers, and motors.

  • Electrical Components: Structural casting for high-voltage transformers, inductors, solenoids, and capacitors.

  • LED Lighting & Solar Enclosures: Waterproof and weatherproof sealing for outdoor LED drivers, junction boxes, and solar panel modules.

Working Principle

The two part potting compound filling machine separately pumps A component and B component potting compound from material tanks. The servo metering system controls the volume of A and B glue according to preset ratio. Two materials flow into mixing unit for fully mixing, then the mixed two part potting compound is dispensed and filled into workpieces. If equipped with vacuum system, the whole potting process runs under vacuum environment to prevent bubble generation.

 Specication

Specification Description
Machine Type 2K Metering and Mixing Machine
Material Epoxy / PU / Silicone / Adhesive
Components A + B
Mixing Ratio Customizable
Metering System Precision Metering Pumps
Mixing Method Dynamic Mixing / Static Mixing
Dispensing Mode Automatic / Programmable
Motion System XYZ 3-Axis / Customized
Material Tanks A Tank + B Tank
Tank Functions Heating / Stirring / Vacuum / Pressure Control
Control System PLC + HMI
Dispensing Valve Pneumatic / Electric / Customized
Cleaning System Optional Automatic Cleaning
Application Potting / Bonding / Sealing / Encapsulation
Production Mode Standalone / Automated Production Line

Note: Exact specifications depend on material viscosity, mixing ratio, dispensing volume, curing characteristics and application requirements.

Why Use a Meter Mix Dispense System?

A meter mix dispense system combines three important functions into one automated process:

Metering → Mixing → Dispensing

Instead of manually measuring Components A and B, the system automatically controls the required amount of each component before mixing and dispensing.

This is particularly useful when manufacturers require:

  • Consistent mixing ratio
  • Accurate dispensing volume
  • Repeatable production
  • Reduced operator involvement
  • Automated production
  • Better process control
  • Reduced material waste

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KPD Automation Equipment Co.ltd
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