Two-Component Epoxy Mixing and Dispensing Machine

The Two-Component PU / Silicone / Epoxy Mixing and Dispensing Machine is an automated solution for processing two-part polyurethane, silicone, epoxy resin and other reactive materials. It combines material preparation, precision dosing, controlled mixing and automatic dispensing into one integrated system.

Components A and B are supplied from separate material tanks and processed independently before entering the metering and mixing unit. The machine controls the delivery of each component according to the required formulation, then mixes the materials and dispenses the compound onto the target part with a programmed dispensing pattern.

The system can be configured with material heating, tank stirring, vacuum degassing, pressure feeding, precision pumps, dynamic mixing, static mixing and automatic dispensing valves according to the characteristics of the material and production process.

With flexible equipment configurations, the machine can handle different material viscosities, mixing ratios and dispensing requirements. It can be used for electronic potting, component encapsulation, transformer potting, automotive electronics, LED components, sensors, power electronics, bonding and sealing applications.

The dispensing system can also be integrated with an XYZ three-axis platform, conveyor, robotic system or customized production line, providing a flexible solution for both laboratory-scale process development and automated industrial manufacturing.

Key Features

Accurate Two-Component Metering

Independent metering of A and B materials allows the machine to maintain a controlled mixing ratio and repeatable dispensing volume.

PU / Silicone / Epoxy Compatible

The system can be configured for different two-component materials including:

• Polyurethane (PU)
• Silicone
• Epoxy resin
• Two-component adhesives
• Sealants

These material categories are widely supported by industrial meter-mix equipment.

Heating and Temperature Control

Material heating can be configured according to the material characteristics to help maintain stable viscosity and improve dispensing performance.

Vacuum Degassing

Vacuum functions can help remove entrapped air from the material before dispensing, particularly for applications where bubble reduction is important.

Automatic Mixing

The machine combines A and B at the required ratio through a static mixer or dynamic mixing valve.

Programmable Dispensing

PLC and HMI controls allow operators to set and manage:

• Dispensing volume
• Flow rate
• Mixing ratio
• Dispensing time
• Motion path
• Heating temperature
• Vacuum parameters
• Production programs

Automatic Cleaning

An automatic cleaning system can be configured for the mixing and dispensing section to reduce material buildup and simplify daily maintenance.

Flexible Automation

The dispensing system can be integrated with:

• XYZ motion platform
• Conveyor line
• Robot
• Automatic production line
• Workpiece positioning system

Applications

• Electronics & Printed Circuit Boards (PCBs): Conformal potting and encapsulation for power supplies, relays, igniters, and control modules.

• Automotive & EV Industry: Thermal conductive potting for Electric Vehicle Battery Management Systems (BMS), sensors, onboard chargers, and motors.

• Electrical Components: Structural casting for high-voltage transformers, inductors, solenoids, and capacitors.

• LED Lighting & Solar Enclosures: Waterproof and weatherproof sealing for outdoor LED drivers, junction boxes, and solar panel modules.

Working Principle

The two part potting compound filling machine separately pumps A component and B component potting compound from material tanks. The servo metering system controls the volume of A and B glue according to preset ratio. Two materials flow into mixing unit for fully mixing, then the mixed two part potting compound is dispensed and filled into workpieces. If equipped with vacuum system, the whole potting process runs under vacuum environment to prevent bubble generation.

 Specication