The 2K Epoxy Resin Dispensing System is designed for accurate metering, mixing, and dispensing of two-component epoxy resin. It automatically delivers resin Part A and hardener Part B according to a preset mixing ratio, ensuring consistent material mixing and reliable dispensing performance for industrial potting, encapsulation, sealing, and casting applications.

Equipped with a precision metering system and an intelligent control system, this machine helps improve dispensing accuracy, reduce material waste, and enhance production efficiency. The dispensing parameters can be adjusted according to material viscosity, mixing ratio, output requirements, and workpiece specifications.

The system is widely used in electronic component potting, PCB encapsulation, transformer insulation, LED driver potting, sensor protection, motor coil encapsulation, and other electrical and industrial applications. Customized configurations are available to meet different production requirements and epoxy resin processing needs.

Key Features

✅ Precision Meter and Mix System High precision pump system for two-component glue, stable ratio control 1:1~10:1, consistent dispensing volume, avoid over-dispensing or shortage.

✅ Real-time Online Mixing AB glue mixes at static/dynamic mixer tip. No glue solidification inside tank or pipeline, reduce material waste.

✅ PLC + Touch Screen Intelligent Control Save multiple dispensing programs, easy parameter setting, USB program import, password protection.

✅ Optional Vacuum Potting Function Vacuum chamber degassing to eliminate air bubbles for compact, smooth potting layer, critical for high voltage electronics.

✅ Wide Material Compatibility Work with epoxy resin, PU polyurethane resin, 2K silicone, thermal conductive AB compound, doming resin.

✅ Anti-dripping and Anti-drawing Design Glue suck-back function, clean glue cut, no dripping at nozzle.

✅ Customizable Automation 3/4 axis motion platform, rotary table, conveyor inline integration, heating and stirring tank, automatic flushing.

✅ Low Material Level Alarm Alert when A/B glue runs low, prevent machine idle running and damage.

Advantages

1. Reduce manual potting cost, greatly improve production throughput and product consistency.
2. Minimize bubble defect rate for electronic encapsulation, enhance insulation and waterproof performance.
3. Stable ratio control to avoid bad batch caused by manual mixing.
4. Modular structure, easy maintenance and spare parts replacement.
5. OEM and ODM available, tailor-made for different product sizes and glue formulas.
6. 12-month warranty, overseas technical support and remote debugging.

Working Principle

Step 1: Material Preparation and Tank Conditioning

✅Heating: Electric heating bands reduce viscosity to ensure smooth flow.

✅Agitation: Continuous stirring prevents filler sedimentation (e.g., thermal conductive powders).

✅Vacuum Degassing: Removes micro-bubbles under negative vacuum pressure (-0.095 MPa) prior to feeding into pumps.

Step 2: High-Precision Metering and Proportioning

✅Dual servo motors drive precision gear or piston pumps to draw Resin (A) and Hardener (B) from separate stainless steel pressure vessels.

✅System monitors volumetric flow rate continuously to enforce precise stoichiometric mixing ratios (1:1 up to 10:1).

Step 3: Mixing Mechanism

✅Dynamic Mixing: A high-speed rotating motor mixes viscous or high-ratio liquids inside an easy-clean dynamic chamber.

✅Static Mixing: Helical mixer nozzles force material layers to cross-divide repeatedly for low-viscosity or quick-curing formulas.

Step 4: Dispensing and Potting

✅Servo-driven XYZ robotic gantry or multi-axis CNC system executes preset potting trajectories (dots, lines, arcs, continuous potting) over the workpiece.

✅Automatic purge cycles flush the mixing valve with solvent or Component A to prevent internal curing during downtime

Specification

Applications

• Electronic components and PCB potting
• Transformer and inductor encapsulation
• LED driver and power supply potting
• Sensor and automotive electronic encapsulation
• Motor coils, capacitors, and electrical components
• Industrial sealing, bonding, and resin casting

Frequently Asked Questions About 2K Epoxy Resin Dispensing Systems

1. What is a 2K epoxy resin dispensing system?

A 2K epoxy resin dispensing system is designed to meter, mix, and dispense two-component epoxy materials, typically resin (Part A) and hardener (Part B). It delivers the two materials according to a preset mixing ratio and mixes them before dispensing for potting, encapsulation, sealing, bonding, and casting applications.

2. How does a 2K epoxy resin dispensing system work?

The system stores Part A and Part B separately and delivers them through independent metering units. The two components are measured according to the required mixing ratio, combined in a mixing valve or mixer, and dispensed onto the target workpiece. The mixed epoxy then cures according to the material manufacturer’s specifications.

3. What mixing ratios can the system support?

The supported mixing ratios depend on the metering system, material properties, and required dispensing accuracy. The appropriate configuration can be selected for ratios such as 1:1, 2:1, 4:1, or other specified ratios. Please confirm whether the ratio is based on weight or volume when selecting equipment.

4. What types of epoxy resin can the machine dispense?

The system can be configured for compatible two-component epoxy resins with different viscosities and processing requirements. Material viscosity, filler content, operating temperature, pot life, and chemical compatibility should be evaluated before selecting pumps, valves, hoses, and mixing components.

5. What industries use 2K epoxy resin dispensing systems?

These systems are widely used in electronics manufacturing, electrical equipment production, automotive electronics, industrial sensors, power supplies, and other industries requiring precise resin application and component protection.

6. Can the system be used for PCB potting?

Yes. A properly configured 2K epoxy resin dispensing system can be used to pot and encapsulate PCBs and electronic assemblies. Dispensing volume, resin viscosity, curing characteristics, and workpiece geometry should be considered to achieve the required filling quality.

7. Can this machine be used for transformer and LED driver potting?

Yes. The system can be configured for transformer encapsulation, inductor potting, LED driver potting, and power supply protection. The required output, mixing ratio, workpiece dimensions, and production cycle determine the suitable machine configuration.

8. Can the dispensing volume and speed be adjusted?

Yes. Depending on the system configuration, dispensing volume, flow rate, and operating parameters can be adjusted to meet different workpiece and production requirements. Actual adjustment ranges depend on the metering pumps, dispensing valve, material properties, and control system.