The Two Component Glue Mixing Machine is an automatic 2K adhesive metering, mixing and dispensing system designed for precise processing of two-component materials. Components A and B are stored separately and accurately metered according to the required mixing ratio before being mixed and dispensed.

The machine is suitable for epoxy, polyurethane, silicone and other two-component adhesives, and can be used for potting, encapsulation, bonding, sealing and filling applications in electronics, automotive, electrical and industrial manufacturing.

Main Features

Accurate Two-Component Metering

Independent A and B material delivery systems provide controlled and repeatable material metering.

Precise Mixing Ratio

The machine can be configured according to the required A/B ratio of the adhesive.

Automatic Mixing

Components A and B are mixed automatically before dispensing through a dynamic mixer or static mixer.

Programmable Dispensing

Dispensing volume, speed and movement path can be programmed according to different production requirements.

Material Heating

Optional heating systems help maintain suitable material viscosity and improve dispensing stability.

Automatic Stirring

Material tanks can be equipped with stirring systems to maintain material consistency during production.

Vacuum Function

Vacuum systems can be integrated for material degassing and improved bubble control.

PLC & HMI Control

The PLC control system and touchscreen HMI provide convenient parameter setting, operation and monitoring.

Working Principle

A Material + B Material → Metering → Ratio Control → Mixing → Degassing → Dispensing → Epoxy Potting → Curing

The A and B epoxy components are stored separately to prevent premature curing. The metering system accurately controls the required ratio, after which the materials are mixed through a static or dynamic mixing valve and dispensed into the target component. Vacuum degassing can be added to reduce trapped air and bubbles.

epoxy potting machine

Applications

Advantages

Consistent Mixing Ratio
Accurate A/B metering helps maintain stable epoxy performance.

Reduced Material Waste
Automatic dispensing controls the required glue volume and dispensing path.

Bubble Reduction
Vacuum degassing helps reduce air bubbles during epoxy potting.

Automation & Repeatability
Programmable XYZ motion allows repeatable point, line, surface and contour dispensing.

Flexible Production
The system can be configured for different epoxy viscosities, mixing ratios, dispensing volumes and production requirements.

Specification

Note: Actual specifications such as dispensing accuracy, output range, tank capacity, mixing ratio and pump type should be selected according to the adhesive material and application requirements.

Compatible Materials

Depending on the machine configuration, it can be used with:

• Epoxy resin
• Polyurethane (PU)
• Silicone
• Two-component adhesive
• AB glue
• 2K adhesive
• Other two-component liquid compounds

Material compatibility should be confirmed according to viscosity, mixing ratio, curing characteristics and chemical properties.

Advantages

• Automatic A/B material metering
• Accurate mixing ratio
• Consistent glue output
• Reduced manual mixing
• Reduced material waste
• Improved production efficiency
• Repeatable dispensing quality
• Programmable dispensing parameters
• Suitable for different adhesive viscosities
• Can be integrated with automatic production lines
• Suitable for customized industrial applications