Designed for high-reliability manufacturing, our Automatic Two-Component (2K) Epoxy Resin Mixing, Dispensing & Potting Machine integrates precision volumetric metering, homogenous dynamic mixing, and 3-axis automated positioning. Engineered to eliminate manual proportioning errors and air bubble defects, this system delivers consistent, void-free encapsulation for electronics, automotive components, and power modules.

Key Features

✅ Precision Meter and Mix System High precision pump system for two-component glue, stable ratio control 1:1~10:1, consistent dispensing volume, avoid over-dispensing or shortage.

✅ Real-time Online Mixing AB glue mixes at static/dynamic mixer tip. No glue solidification inside tank or pipeline, reduce material waste.

✅ PLC + Touch Screen Intelligent Control Save multiple dispensing programs, easy parameter setting, USB program import, password protection.

✅ Optional Vacuum Potting Function Vacuum chamber degassing to eliminate air bubbles for compact, smooth potting layer, critical for high voltage electronics.

✅ Wide Material Compatibility Work with epoxy resin, PU polyurethane resin, 2K silicone, thermal conductive AB compound, doming resin.

✅ Anti-dripping and Anti-drawing Design Glue suck-back function, clean glue cut, no dripping at nozzle.

✅ Customizable Automation 3/4 axis motion platform, rotary table, conveyor inline integration, heating and stirring tank, automatic flushing.

✅ Low Material Level Alarm Alert when A/B glue runs low, prevent machine idle running and damage.

Advantages

1. Reduce manual potting cost, greatly improve production throughput and product consistency.
2. Minimize bubble defect rate for electronic encapsulation, enhance insulation and waterproof performance.
3. Stable ratio control to avoid bad batch caused by manual mixing.
4. Modular structure, easy maintenance and spare parts replacement.
5. OEM and ODM available, tailor-made for different product sizes and glue formulas.
6. 12-month warranty, overseas technical support and remote debugging.

Working Principle

Step 1: Material Preparation and Tank Conditioning

✅Heating: Electric heating bands reduce viscosity to ensure smooth flow.

✅Agitation: Continuous stirring prevents filler sedimentation (e.g., thermal conductive powders).

✅Vacuum Degassing: Removes micro-bubbles under negative vacuum pressure (-0.095 MPa) prior to feeding into pumps.

Step 2: High-Precision Metering and Proportioning

✅Dual servo motors drive precision gear or piston pumps to draw Resin (A) and Hardener (B) from separate stainless steel pressure vessels.

✅System monitors volumetric flow rate continuously to enforce precise stoichiometric mixing ratios (1:1 up to 10:1).

Step 3: Mixing Mechanism

✅Dynamic Mixing: A high-speed rotating motor mixes viscous or high-ratio liquids inside an easy-clean dynamic chamber.

✅Static Mixing: Helical mixer nozzles force material layers to cross-divide repeatedly for low-viscosity or quick-curing formulas.

Step 4: Dispensing and Potting

✅Servo-driven XYZ robotic gantry or multi-axis CNC system executes preset potting trajectories (dots, lines, arcs, continuous potting) over the workpiece.

✅Automatic purge cycles flush the mixing valve with solvent or Component A to prevent internal curing during downtime

Specification

Applications

✅ Electronic components and PCB potting

✅ Transformer and inductor encapsulation

✅ LED driver and power supply potting

✅ Sensor and automotive electronic encapsulation

✅ Motor coils, capacitors, and electrical components

✅ Industrial sealing, bonding, and resin casting

💡 Key Value Highlights

✅ 🎯 Precision Volumetric Ratio Control: Servo-driven metering ensures exact A:B formulation accuracy within 2%

✅ 🧼 Void-Free Potting: Combined vacuum degassing tanks and dynamic mixing nozzles eliminate micro-bubbles completely.

✅ 🤖 Programmable 3-Axis Motion: Multi-pattern path programming for dots, continuous lines, circles, and complex 3D contours.

✅ 🧹 Auto-Flushing & Anti-Clogging: Smart standby purges and automated solvent cleaning prevent premature resin curing in the mixing chamber.

✅ 🏭 Broad Resin Compatibility: Fully compatible with 2-part epoxies, polyurethanes (PU), and silicone potting compounds.

❓ Frequently Asked Questions (FAQ)

Q1: What types of resins are compatible with this potting machine?

A: Our automatic dispensing machine is designed for a wide range of two-component (2K/2-part) resin systems, including epoxy resins, polyurethanes (PU), and silicones. It efficiently handles materials with low to high viscosities, as well as resins containing abrasive fillers (such as aluminum oxide or silica powder).

Q2: How does the machine ensure accurate A:B mixing ratios?

A: The system utilizes servo-driven high-precision metering pumps (gear or piston pumps depending on viscosity and abrasive filler content). Coupled with an intelligent PLC ratio monitor, it continuously tracks volumetric delivery to maintain precise A:B ratio control (typically from 1:1 up to 10:1) with an accuracy within ±2.0%.

Q3: How do you prevent air bubbles in the potted components?

A: We use a multi-stage bubble elimination process:

1. Material Tank Vacuum Degassing: Removes dissolved air from components A and B before pumping.

2. Homogenous Dynamic/Static Mixing: Blends the two parts smoothly without introducing external air.

3. (Optional) Vacuum Chamber Potting: Allows the dispensing and curing cycle to occur entirely within a vacuum environment for critical high-voltage or zero-void application standards.

Q4: What happens if the machine stops during production? Will the resin harden in the mixing head?

A: The machine is equipped with an Automated Anti-Clogging & Auto-Flushing System. You can set a standby timer; if the system remains idle longer than the pot-life of the mixed epoxy, it will automatically initiate a purge or flushing cycle using air/cleaning solvent to prevent resin from curing inside the mixing chamber.